Semiconductor structure and preparation method

The invention provides a semiconductor structure and a preparation method. The semiconductor structure comprises a supporting substrate, a rewiring layer, a packaging structure, a dielectric layer and a metal layer. Wherein the rewiring layer is located on the supporting substrate; the packaging structure is located on the rewiring layer, the packaging structure comprises a metal column and a regular trapezoid plastic packaging layer, the first end of the metal column is electrically connected with the rewiring layer, and the second end of the metal column is exposed out of the regular trapezoid plastic packaging layer; the dielectric layer is located on the surface of the regular trapezoidal plastic package layer; the metal layer is located on the dielectric layer, and the metal layer is electrically connected with the second end of the metal column. According to the invention, through the regular trapezoidal plastic packaging layer with the inclined side surface, the uniformly distributed metal layers can b