Single-sided polishing device, single-sided polishing method, and polishing pad
The present invention relates to a single-sided polishing device comprising: a bottom platform having a groove for vacuum suction; the detachable polishing platform is fixed through vacuum adsorption; a polishing pad; the present invention relates to a single-sided polishing device for polishing a w...
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| creator | ISHII KAORU UENO JUNICHI |
| description | The present invention relates to a single-sided polishing device comprising: a bottom platform having a groove for vacuum suction; the detachable polishing platform is fixed through vacuum adsorption; a polishing pad; the present invention relates to a single-sided polishing device for polishing a wafer, the single-sided polishing device comprising a polishing pad for polishing the surface of the wafer held by a polishing head and a polishing head for holding the wafer, the polishing pad comprising a polishing layer for polishing the surface of the wafer, a first adhesive layer, a PET sheet layer, a second adhesive layer, an elastic layer, and a third adhesive layer for attaching to a polishing stage, which are laminated in this order, and the compression ratio of the polishing pad is more than 16%. As a result, the present invention provides a single-sided polishing device capable of suppressing deterioration of the NT quality of a wafer after polishing in single-sided polishing of the wafer (in particular, |
| format | Patent |
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As a result, the present invention provides a single-sided polishing device capable of suppressing deterioration of the NT quality of a wafer after polishing in single-sided polishing of the wafer (in particular,</description><language>chi ; eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230228&DB=EPODOC&CC=CN&NR=115720542A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230228&DB=EPODOC&CC=CN&NR=115720542A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ISHII KAORU</creatorcontrib><creatorcontrib>UENO JUNICHI</creatorcontrib><title>Single-sided polishing device, single-sided polishing method, and polishing pad</title><description>The present invention relates to a single-sided polishing device comprising: a bottom platform having a groove for vacuum suction; the detachable polishing platform is fixed through vacuum adsorption; a polishing pad; the present invention relates to a single-sided polishing device for polishing a wafer, the single-sided polishing device comprising a polishing pad for polishing the surface of the wafer held by a polishing head and a polishing head for holding the wafer, the polishing pad comprising a polishing layer for polishing the surface of the wafer, a first adhesive layer, a PET sheet layer, a second adhesive layer, an elastic layer, and a third adhesive layer for attaching to a polishing stage, which are laminated in this order, and the compression ratio of the polishing pad is more than 16%. As a result, the present invention provides a single-sided polishing device capable of suppressing deterioration of the NT quality of a wafer after polishing in single-sided polishing of the wafer (in particular,</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAPzsxLz0nVLc5MSU1RKMjPySzOAIoopKSWZSan6igUY5fOTS3JyE_RUUjMQxYtSEzhYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxzn6GhqbmRgamJkaOxsSoAQA2WzaU</recordid><startdate>20230228</startdate><enddate>20230228</enddate><creator>ISHII KAORU</creator><creator>UENO JUNICHI</creator><scope>EVB</scope></search><sort><creationdate>20230228</creationdate><title>Single-sided polishing device, single-sided polishing method, and polishing pad</title><author>ISHII KAORU ; UENO JUNICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115720542A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ISHII KAORU</creatorcontrib><creatorcontrib>UENO JUNICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ISHII KAORU</au><au>UENO JUNICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Single-sided polishing device, single-sided polishing method, and polishing pad</title><date>2023-02-28</date><risdate>2023</risdate><abstract>The present invention relates to a single-sided polishing device comprising: a bottom platform having a groove for vacuum suction; the detachable polishing platform is fixed through vacuum adsorption; a polishing pad; the present invention relates to a single-sided polishing device for polishing a wafer, the single-sided polishing device comprising a polishing pad for polishing the surface of the wafer held by a polishing head and a polishing head for holding the wafer, the polishing pad comprising a polishing layer for polishing the surface of the wafer, a first adhesive layer, a PET sheet layer, a second adhesive layer, an elastic layer, and a third adhesive layer for attaching to a polishing stage, which are laminated in this order, and the compression ratio of the polishing pad is more than 16%. 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| language | chi ; eng |
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| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING |
| title | Single-sided polishing device, single-sided polishing method, and polishing pad |
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