Single-sided polishing device, single-sided polishing method, and polishing pad

The present invention relates to a single-sided polishing device comprising: a bottom platform having a groove for vacuum suction; the detachable polishing platform is fixed through vacuum adsorption; a polishing pad; the present invention relates to a single-sided polishing device for polishing a wafer, the single-sided polishing device comprising a polishing pad for polishing the surface of the wafer held by a polishing head and a polishing head for holding the wafer, the polishing pad comprising a polishing layer for polishing the surface of the wafer, a first adhesive layer, a PET sheet layer, a second adhesive layer, an elastic layer, and a third adhesive layer for attaching to a polishing stage, which are laminated in this order, and the compression ratio of the polishing pad is more than 16%. As a result, the present invention provides a single-sided polishing device capable of suppressing deterioration of the NT quality of a wafer after polishing in single-sided polishing of the wafer (in particular,