Alternating-current solid-state relay

An alternating current (AC) solid state relay includes a package, at least one silicon (Si) semiconductor device, and at least one wide band gap (WBG) semiconductor device electrically connected to the at least one silicon semiconductor device. Each of the silicon semiconductor device and the WBG semiconductor device is disposed entirely inside the package to minimize the space occupied by the AC solid state relay. Each of the silicon semiconductor device and the WBG semiconductor device is electrically connected to each other inside the package to minimize cost and maximize load efficiency while achieving a predetermined rated current capability of the AC solid state relay. 一种交流（AC）固态继电器包括封装、至少一个硅（Si）半导体装置、以及电连接到所述至少一个硅半导体装置的至少一个宽带隙（WBG）半导体装置。硅半导体装置和WBG半导体装置中的每一者完全设置在封装内部，以使由交流固态继电器占用的空间最小化。硅半导体装置和WBG半导体装置中的每一者在封装内部彼此电连接，以使成本最小化并使负载效率最大化，同时实现交流固态继电器的预定的额定电流能力。