Substrate structure

A substrate structure comprises a first electrical contact pad formed on an insulating layer of a substrate body, and the first electrical contact pad comprises a first pad part arranged on the insulating layer and at least one first convex part embedded in the insulating layer, so that the first pa...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CAI WEISHENG, JIANG YIZHEN, WENG PEIGENG, CAI FANGLIN
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:A substrate structure comprises a first electrical contact pad formed on an insulating layer of a substrate body, and the first electrical contact pad comprises a first pad part arranged on the insulating layer and at least one first convex part embedded in the insulating layer, so that the first pad part is electrically connected with a circuit layer in the insulating layer through a conductive blind hole. And the first convex part is not electrically connected with the circuit layer, so that the surface of the metal layer formed on the insulating layer meets the coplanar requirement through the design of the first convex part. 一种基板结构,包括于基板本体的绝缘层上形成有第一电性接触垫,其中,该第一电性接触垫包含一设于该绝缘层上的第一垫部及至少一嵌埋于该绝缘层中的第一凸部,以令该第一垫部经由导电盲孔电性连接该绝缘层内的线路层,且该第一凸部未电性连接该线路层,以经由该第一凸部的设计,以令形成于该绝缘层上的金属层表面达到共平面的需求。