SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND ELECTROSTATIC CHUCK MANUFACTURING METHOD

The invention discloses a substrate processing apparatus, a substrate processing method, and an electrostatic chuck manufacturing method. Provided is an electrostatic chuck comprising: a chuck member which supports a substrate and in which at least one pin hole penetrates in the vertical direction,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE DONGAN, KIM KYO-BONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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