SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND ELECTROSTATIC CHUCK MANUFACTURING METHOD

The invention discloses a substrate processing apparatus, a substrate processing method, and an electrostatic chuck manufacturing method. Provided is an electrostatic chuck comprising: a chuck member which supports a substrate and in which at least one pin hole penetrates in the vertical direction, and in which a lift pin is housed so as to be able to lift; and an expansion member which is provided on the inner periphery of the pin hole, is expandable, and has an inner peripheral surface that is in close contact with the outer peripheral surface of the lift pin accommodated in the pin hole during expansion, and the diameter of the pin hole is changed by the expansion member. 公开一种基板处理装置和基板处理方法以及静电卡盘制造方法。提供一种静电卡盘，包括：卡盘部件，支承基板并至少一个销孔在上下方向上贯通，并且提升销能够升降地容纳于所述销孔；以及膨胀部件，提供于所述销孔的内周并能够膨胀，并且具有膨胀时与容纳于所述销孔的所述提升销的外周面紧贴的内周面，通过所述膨胀部件使所述销孔的直径进行变化。