One-time hot melting tin soldering lead sealing device

The invention relates to the technical field of lead sealing, in particular to a one-time hot melting tin soldering lead sealing device which comprises a lead sealing body and a copper pipe located in a shell and penetrating through the two opposite side faces of the shell, a tin soldering layer is arranged on the inner wall of the copper pipe, and threading holes used for containing lead sealing wires are formed in the two opposite side faces of the shell and located in the two ends of the copper pipe. The heating device is provided with a heating contact making contact with the outer side face of the copper pipe, and the heating contact is used for heating the copper pipe and soldering tin in the copper pipe. The lead sealing body is fixed with the lead sealing line penetrating into the copper pipe through the copper pipe with the soldering tin on the inner wall after being heated to achieve lead sealing manufacturing, in the obtained lead sealing, the lead sealing line is fixed to the inner wall of the cop