Low dielectric rubber resin material and low dielectric metal substrate

The invention discloses a low-dielectric rubber resin material and a low-dielectric metal substrate, and the low-dielectric rubber resin material comprises a low-dielectric rubber resin composition and an inorganic filler, the low-dielectric rubber resin composition comprises the following components in percentage by weight: 5 to 40 percent of liquid rubber, 20 to 70 percent of polyphenyl ether resin, 5 to 30 percent of bismaleimide resin and 20 to 45 percent of cross-linking agent. The weight average molecular weight of the liquid rubber is 800 g/mol to 6000 g/mol. The iodine value of the liquid rubber is 30 g/100 g to 60 g/100 g. 本发明公开一种低介电橡胶树脂材料及低介电金属基板，低介电橡胶树脂材料包括一低介电橡胶树脂组成物及一无机填料，所述低介电橡胶树脂组成物包括5重量百分比至40重量百分比的液态橡胶、20重量百分比至70重量百分比的聚苯醚树脂、5重量百分比至30重量百分比的双马来酰亚胺树脂以及20重量百分比至45重量百分比的交联剂。液态橡胶的重量平均分子量为800g/mol至6000g/mol。液态橡胶的碘价为30g/100g至60g/100g。