Photosensitive component, camera module and electronic equipment

The invention discloses a photosensitive component, a camera module and electronic equipment. The photosensitive assembly comprises a photosensitive chip and a circuit board assembly, the circuit board assembly comprises a circuit board body and an adjusting layer, and the photosensitive chip is arranged on the circuit board body and electrically connected to the circuit board body. And the adjusting layer is formed on the lower surface of the circuit board main body and is provided with a structural configuration used for adjusting the bending degree of the circuit board main body so as to adjust the bending degree of the photosensitive chip. In this way, the bending degree of the photosensitive chip is adjusted through the adjusting layer so that the photosensitive chip can be matched with the field curvature of the optical lens. 公开了一种感光组件、摄像模组和电子设备。所述感光组件包括：感光芯片和线路板组件，所述线路板组件包括线路板主体和调整层，所述感光芯片设置于所述线路板主体上且电连接于所述线路板主体，所述调整层形成于所述线路板主体的下表面且具有用于调整所述线路板主体的弯曲程度以调整所述感光芯片的弯曲程度的结构配置。这样，通过所述调整层调节所述感光芯片的弯曲程度以使之适配于光学镜头