Differential MEMS chip, microphone and electronic equipment
The invention provides a differential MEMS chip, a microphone and an electronic device, the differential MEMS chip comprises a substrate and a back polar plate and a thin film which are both installed on the substrate, a sound inlet is formed in the substrate, a plurality of holes are formed in the...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a differential MEMS chip, a microphone and an electronic device, the differential MEMS chip comprises a substrate and a back polar plate and a thin film which are both installed on the substrate, a sound inlet is formed in the substrate, a plurality of holes are formed in the back polar plate, an air leakage structure is formed in the thin film, the back polar plate is arranged on the side, away from the sound inlet, of the thin film, and the air leakage structure is arranged on the back polar plate. The film comprises piezoelectric layers and electrode layers which are alternately arranged up and down, the number of the electrode layers is at least two, the substrate is further provided with a back electrode bonding pad and an electrode bonding pad, the back electrode bonding pad is electrically connected with the back electrode plate, and the electrode bonding pad is electrically connected with the electrode layers. The differential MEMS chip has the advantages of being capable of pre |
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