Method for regenerating silicon powder by using waste molding compound as raw material, regenerated silicon powder and epoxy molding compound for TO packaging

The invention belongs to the technical field of resource utilization of waste plastic packaging materials, and particularly relates to a method for regenerating silicon powder by taking waste plastic packaging materials as raw materials, regenerated silicon powder and an epoxy plastic packaging material for TO packaging. The method comprises the following steps: crushing the waste plastic packaging material, roasting under a stirring condition, and carrying out magnetic separation; carrying out ball milling on the obtained material, and carrying out magnetic separation to obtain regenerated silicon powder; the roasting conditions are as follows: the roasting temperature is 800-1000 DEG C, and the roasting time is 8-15 hours. The obtained regenerated silicon powder can be used for TO-series epoxy molding compounds for packaging, and has important significance for saving the cost of materials used by the molding compounds. 本发明属于废旧塑封料资源化利用技术领域，具体涉及一种以废旧塑封料为原料进行硅粉再生的方法、再生硅粉、TO封装用环氧塑封料。该方法包括以下步骤：将废旧塑封料粉碎，在搅拌条件下进行焙