Low-cost and low-resistance conductive microsphere, preparation method thereof, conductive adhesive and preparation method thereof
The invention relates to the technical field of conductive microspheres, and particularly discloses a low-cost and low-resistance conductive microsphere, a preparation method thereof, a conductive adhesive and a preparation method thereof. The preparation method comprises the following steps: S1, ta...
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| creator | KONG XIANGYU ZHONG JINGRONG GONG HUOHONG WAN XIANFEI YAO CHONGYI CHO CHANG HOO |
| description | The invention relates to the technical field of conductive microspheres, and particularly discloses a low-cost and low-resistance conductive microsphere, a preparation method thereof, a conductive adhesive and a preparation method thereof. The preparation method comprises the following steps: S1, taking a proper amount of high-molecular polymeric microspheres, and coarsening to prepare polymeric microspheres A with colloidal palladium adsorption capacity on the surface; s2, taking the polymeric microspheres A prepared in S1, and carrying out adsorption, sensitization and activation of colloidal palladium and reduction of colloidal palladium to prepare polymeric microspheres B with catalytic activity on the surface; and S3, carrying out chemical nickel plating on the polymeric microspheres B prepared in S2 by adopting a radiation and plating method to prepare polymeric microspheres C with nano particle nickel layers on the surfaces of the polymeric microspheres, and passivating, washing and drying to obtain th |
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The preparation method comprises the following steps: S1, taking a proper amount of high-molecular polymeric microspheres, and coarsening to prepare polymeric microspheres A with colloidal palladium adsorption capacity on the surface; s2, taking the polymeric microspheres A prepared in S1, and carrying out adsorption, sensitization and activation of colloidal palladium and reduction of colloidal palladium to prepare polymeric microspheres B with catalytic activity on the surface; and S3, carrying out chemical nickel plating on the polymeric microspheres B prepared in S2 by adopting a radiation and plating method to prepare polymeric microspheres C with nano particle nickel layers on the surfaces of the polymeric microspheres, and passivating, washing and drying to obtain th</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASTING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS DIFFUSION TREATMENT OF METALLIC MATERIAL DYES ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES POWDER METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING METALLIC POWDER |
| title | Low-cost and low-resistance conductive microsphere, preparation method thereof, conductive adhesive and preparation method thereof |
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