Low-cost and low-resistance conductive microsphere, preparation method thereof, conductive adhesive and preparation method thereof
The invention relates to the technical field of conductive microspheres, and particularly discloses a low-cost and low-resistance conductive microsphere, a preparation method thereof, a conductive adhesive and a preparation method thereof. The preparation method comprises the following steps: S1, ta...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of conductive microspheres, and particularly discloses a low-cost and low-resistance conductive microsphere, a preparation method thereof, a conductive adhesive and a preparation method thereof. The preparation method comprises the following steps: S1, taking a proper amount of high-molecular polymeric microspheres, and coarsening to prepare polymeric microspheres A with colloidal palladium adsorption capacity on the surface; s2, taking the polymeric microspheres A prepared in S1, and carrying out adsorption, sensitization and activation of colloidal palladium and reduction of colloidal palladium to prepare polymeric microspheres B with catalytic activity on the surface; and S3, carrying out chemical nickel plating on the polymeric microspheres B prepared in S2 by adopting a radiation and plating method to prepare polymeric microspheres C with nano particle nickel layers on the surfaces of the polymeric microspheres, and passivating, washing and drying to obtain th |
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