HEAT TREATMENT DEVICE

The invention provides a heat treatment device which can perform more detailed control on the front surface temperature, the back surface temperature and the deviation of the in-plane temperature distribution of a workpiece to which an object to be heat treated is attached by a simple method even wh...

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Hauptverfasser: ISO AKINORI, TAKAHASHI TAKASHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention provides a heat treatment device which can perform more detailed control on the front surface temperature, the back surface temperature and the deviation of the in-plane temperature distribution of a workpiece to which an object to be heat treated is attached by a simple method even when the workpiece is heated from the two surfaces of the workpiece. The heat treatment apparatus includes: a chamber; a first heating part; a second heating unit facing the first heating unit; the at least one first soaking plate is arranged between the first heating part and the second heating part; the at least one second vapor chamber is arranged between the first vapor chamber and the second heating part; the first processing area is arranged between the first vapor chamber and the second vapor chamber and is used for supporting a workpiece; a first temperature control unit provided on the first vapor chamber; and a second temperature control unit provided on the second vapor chamber. The first temperature contr