Image sensor package and camera device including same

A camera device according to an embodiment of the present invention comprises: a printed circuit board; a heat dissipation layer disposed on the first surface of the printed circuit board; and an image sensor disposed on the heat dissipation layer, in which the printed circuit board has a plurality...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	EOM SEONG SU, LEE SOL-NIP, LEE HEE-JUNG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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