Image sensor package and camera device including same

A camera device according to an embodiment of the present invention comprises: a printed circuit board; a heat dissipation layer disposed on the first surface of the printed circuit board; and an image sensor disposed on the heat dissipation layer, in which the printed circuit board has a plurality of through holes passing through the printed circuit board from a first surface of the printed circuit board to a second surface of the printed circuit board, which is a reverse side of the first surface, and the plurality of through holes are in contact with the heat dissipation layer. 根据本发明的实施例的相机装置包括：印刷电路板；设置在印刷电路板的第一表面上的散热层；以及设置在散热层上的图像传感器，其中，印刷电路板具有从印刷电路板的第一表面穿过印刷电路板到作为第一表面的反面的印刷电路板的第二表面的多个通孔，并且多个通孔与散热层接触。