METHOD FOR PRODUCING AN ELECTRONIC CHIP CARD MODULE CIRCUIT WITH COLOR CONTACT AND CIRCUIT PRODUCED BY SAID METHOD

The invention relates to a circuit, such as a circuit of the printed circuit type, for producing a module intended to be integrated in a chip card. The module has an electrical contact strip or connector (3) region for the connection and communication of the chip to a read/write system. In order to make them have a different color than the generally used gold or silver plating, the electrical contact regions (3) are at least partially covered with a surface layer (14) comprising a compound of the XpOqNrCs type, where X may be Hf, Ta, Zr, Nb, Mo, Cr, V, Ti or Sc, where p, qgt; and r > = 0 and/or s > = 0. The invention also relates to a method for producing such a circuit. 本发明涉及一种电路，例如印刷电路类型的电路，用于生产旨在集成于芯片卡中的模块。该模块具有电接触片-或连接器(3)-区域，用于芯片与读/写系统的连接和通信。为了使它们具有与通常使用的镀金或镀银不同的颜色，这些电接触区域(3)至少部分地覆盖有表面层(14)，该表面层(14)包括XpOqNrCs类型的化合物，其中X可以是Hf、Ta、Zr、Nb、Mo、Cr、V、Ti或Sc，其中p、q>0,并且r≥0和/或s≥0。本发明还涉及一种制造这种电路的方法。