POLISHING APPARATUS, PROCESSING SYSTEM, AND POLISHING METHOD

The grinding device suitable for surface reference grinding is achieved. A polishing apparatus (100) includes: a plurality of substrate holding mechanisms (200) disposed along a first direction (X direction) of a substrate (300); a plurality of polishing heads (201) disposed along a second direction...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOBAYASHI KENICHI, FURUSAWA, MANATO, AKAZAWA KENICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!