POLISHING APPARATUS, PROCESSING SYSTEM, AND POLISHING METHOD

The grinding device suitable for surface reference grinding is achieved. A polishing apparatus (100) includes: a plurality of substrate holding mechanisms (200) disposed along a first direction (X direction) of a substrate (300); a plurality of polishing heads (201) disposed along a second direction...

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Bibliographische Detailangaben
Hauptverfasser:	KOBAYASHI KENICHI, FURUSAWA, MANATO, AKAZAWA KENICHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	The grinding device suitable for surface reference grinding is achieved. A polishing apparatus (100) includes: a plurality of substrate holding mechanisms (200) disposed along a first direction (X direction) of a substrate (300); a plurality of polishing heads (201) disposed along a second direction (Y direction) intersecting the first direction (X direction); a stage (202) that faces the plurality of polishing heads (201) with the substrate (300) therebetween, and extends in a second direction (Y direction); and drive mechanisms (500, 600) for moving the plurality of polishing heads (201) and the stage (202) in the first direction (X direction). 实现一种适合表面基准研磨的研磨装置。研磨装置100包含：沿着基板300的第一方向(X方向)配置的多个基板保持机构200；沿着与第一方向(X方向)交叉的第二方向(Y方向)配置的多个研磨头201；夹着基板300而与多个研磨头201相对，并在第二方向(Y方向)延伸的载台202；及用于使多个研磨头201与载台202在第一方向(X方向)移动的驱动机构500、600。