Heat dissipation device, electronic equipment and electric equipment

The invention provides a heat dissipation device, electronic equipment and electric equipment. The heat dissipation device comprises a liquid cooling plate and heat exchange fins, the liquid cooling plate comprises a first liquid cooling part and a second liquid cooling part, the first liquid coolin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	GUO LIANGYIN, CHEN YATI, GAN SHAOPENG, JIHO CHO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention provides a heat dissipation device, electronic equipment and electric equipment. The heat dissipation device comprises a liquid cooling plate and heat exchange fins, the liquid cooling plate comprises a first liquid cooling part and a second liquid cooling part, the first liquid cooling part is provided with a first inner surface and a first mounting surface which are oppositely arranged, and the second liquid cooling part is provided with a second inner surface and a second mounting surface which are oppositely arranged; the heat exchange fins are connected between a first inner surface of the first liquid cooling part and a second inner surface of the second liquid cooling part, a first mounting surface of the first liquid cooling part and a second mounting surface of the second liquid cooling part are used for mounting electronic devices, a first cooling flow channel is arranged in the first liquid cooling part, and a second cooling flow channel is arranged in the second liquid cooling part.