Low-crosstalk high-speed optical module transmitting assembly

The invention discloses a low-crosstalk high-speed optical module transmitting assembly. Comprising an ODSP chip, a PCB, a substrate and a transmission line. The ODSP chip is arranged on the PCB, the laser chip is arranged on the substrate, a plurality of metal bonding pads and a plurality of BGA bo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: WANG SHEN, YANG JUNQI, XUE ZHENFENG, GAO WANCHAO, SUN LIPING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a low-crosstalk high-speed optical module transmitting assembly. Comprising an ODSP chip, a PCB, a substrate and a transmission line. The ODSP chip is arranged on the PCB, the laser chip is arranged on the substrate, a plurality of metal bonding pads and a plurality of BGA bonding pads are arranged on the surface of the PCB, the laser chip is connected with the corresponding metal bonding pads, the ODSP chip is connected with the corresponding BGA bonding pads, and each metal bonding pad is electrically connected with the corresponding BGA bonding pad to form a corresponding transmission channel; the PCB comprises a first metal layer, a second metal layer, a first insulating layer, a second insulating layer and a third insulating layer, and the metal bonding pad and the BGA bonding pad are arranged on the first metal layer; signals of adjacent transmission channels alternately pass through the transmission line of the first metal layer and the transmission line of the second metal laye