Wafer adsorption device and laser annealing equipment

The invention provides a wafer adsorption device and laser annealing equipment. The wafer adsorption device comprises a first adsorption structure and a second adsorption structure, wherein the first adsorption structure comprises a first base body, a first air channel and a first assembling part, the first air channel and the first assembling part are fixed to the first base body, the first air channel is communicated to air exhaust equipment, and the first assembling part is used for being fixedly connected with a second assembling part of the second adsorption structure in a detachable mode; the first adsorption structure and the second adsorption structure are detachably and fixedly connected; the second adsorption structure comprises a second base body, a second air channel and a second assembling part, the second air channel and the second assembling part are fixed to the second base body, the second air channel is communicated to an air exhaust device and an adsorption contact face of the second adsorp