Dual-curing adhesive and preparation method thereof
The invention discloses a dual-curing adhesive and a preparation method of the dual-curing adhesive. The dual-curing adhesive comprises the following components in parts by mass: 100 parts of total parts, the dual-curing adhesive is prepared from the following components in parts by weight: 30 to 55...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a dual-curing adhesive and a preparation method of the dual-curing adhesive. The dual-curing adhesive comprises the following components in parts by mass: 100 parts of total parts, the dual-curing adhesive is prepared from the following components in parts by weight: 30 to 55 parts of epoxy acrylate, 30 to 50 parts of dual-curing oligomer, 10 to 30 parts of epoxy acrylic diluent, 1 to 3 parts of cationic photoinitiator, 2 to 4 parts of radical initiator, 0.1 to 0.5 part of photosensitizer, 0.5 to 2 parts of coupling agent, 0.5 to 2 parts of hydrophobic material and 0.05 to 0.3 part of dispersing agent. The dual-curing oligomer in the dual-curing adhesive has at least two oxetane and at least two double bonds, on one hand, the curing speed of the oxetane is higher than that of epoxy groups, and on the other hand, due to the existence of multiple functional groups, the reaction activity is improved, the curing degree is improved, and meanwhile, the curing time is shortened. The crosslink |
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