Preparation method and application of heat-resistant modified epoxy resin insulation paste

The invention relates to the technical field of epoxy resin adhesives, and discloses a preparation method and application of a heat-resistant modified epoxy resin insulating adhesive, a poly (amide-etherimide) block copolymer is grafted on the surface of titanium dioxide, the block copolymer is a po...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: PAN PENGFANG, PAN PENGYANG
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention relates to the technical field of epoxy resin adhesives, and discloses a preparation method and application of a heat-resistant modified epoxy resin insulating adhesive, a poly (amide-etherimide) block copolymer is grafted on the surface of titanium dioxide, the block copolymer is a polyamide molecular chain containing a flexible ether chain segment and a rigid imide ring chain segment, and the block copolymer is a polyamide molecular chain containing a flexible ether chain segment and a rigid imide ring chain segment. The epoxy resin is filled and modified by alkene, the alkene has good compatibility and interfacial strength with the epoxy resin, agglomeration of titanium dioxide nanoparticles is overcome, synergistic reinforcing and toughening effects are achieved, the toughness and strength of the epoxy resin are improved, meanwhile, poly (amide-etherimide) modified titanium dioxide uniformly forms crosslinking sites in the epoxy resin, and the toughness and strength of the epoxy resin are im