Color sensor module structure package
The invention discloses a color sensor module structure package. The color sensor module structure package comprises a substrate, a chip and a transparent molding substance, the chip is disposed on the substrate and has an ambient light sensor and a proximity sensor. The transparent molding substanc...
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| creator | HUANG JIANYU HONG SHANGMING WU GAOBIN DENG ZHONGHAO |
| description | The invention discloses a color sensor module structure package. The color sensor module structure package comprises a substrate, a chip and a transparent molding substance, the chip is disposed on the substrate and has an ambient light sensor and a proximity sensor. The transparent molding substance covers the chip. A plurality of diffusion particles are doped in the transparent molding substance, and the transparent molding substance is provided with a groove area, and the groove area is located above the proximity sensor.
本发明公开一种颜色传感器模块结构封装，其包括一基板、一芯片以及一透明模塑物质。该芯片设置在该基板上，且具有一环境光传感器以及一近接传感器。该透明模塑物质覆盖该芯片。该透明模塑物质内掺杂多个扩散粒子，而且该透明模塑物质具有一凹槽区域，其中该凹槽区域位于该近接传感器上方。 |
| format | Patent |
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本发明公开一种颜色传感器模块结构封装，其包括一基板、一芯片以及一透明模塑物质。该芯片设置在该基板上，且具有一环境光传感器以及一近接传感器。该透明模塑物质覆盖该芯片。该透明模塑物质内掺杂多个扩散粒子，而且该透明模塑物质具有一凹槽区域，其中该凹槽区域位于该近接传感器上方。</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; COLORIMETRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT ; MEASURING ; PHYSICS ; RADIATION PYROMETRY ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230124&DB=EPODOC&CC=CN&NR=115642189A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230124&DB=EPODOC&CC=CN&NR=115642189A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG JIANYU</creatorcontrib><creatorcontrib>HONG SHANGMING</creatorcontrib><creatorcontrib>WU GAOBIN</creatorcontrib><creatorcontrib>DENG ZHONGHAO</creatorcontrib><title>Color sensor module structure package</title><description>The invention discloses a color sensor module structure package. The color sensor module structure package comprises a substrate, a chip and a transparent molding substance, the chip is disposed on the substrate and has an ambient light sensor and a proximity sensor. The transparent molding substance covers the chip. A plurality of diffusion particles are doped in the transparent molding substance, and the transparent molding substance is provided with a groove area, and the groove area is located above the proximity sensor.
本发明公开一种颜色传感器模块结构封装，其包括一基板、一芯片以及一透明模塑物质。该芯片设置在该基板上，且具有一环境光传感器以及一近接传感器。该透明模塑物质覆盖该芯片。该透明模塑物质内掺杂多个扩散粒子，而且该透明模塑物质具有一凹槽区域，其中该凹槽区域位于该近接传感器上方。</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>COLORIMETRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>RADIATION PYROMETRY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB1zs_JL1IoTs0rBlK5-SmlOakKxSVFpcklpUWpCgWJydmJ6ak8DKxpiTnFqbxQmptB0c01xNlDN7UgPz61GKgqNS-1JN7Zz9DQ1MzEyNDC0tGYGDUAWg0ncg</recordid><startdate>20230124</startdate><enddate>20230124</enddate><creator>HUANG JIANYU</creator><creator>HONG SHANGMING</creator><creator>WU GAOBIN</creator><creator>DENG ZHONGHAO</creator><scope>EVB</scope></search><sort><creationdate>20230124</creationdate><title>Color sensor module structure package</title><author>HUANG JIANYU ; HONG SHANGMING ; WU GAOBIN ; DENG ZHONGHAO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115642189A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>COLORIMETRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>RADIATION PYROMETRY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HUANG JIANYU</creatorcontrib><creatorcontrib>HONG SHANGMING</creatorcontrib><creatorcontrib>WU GAOBIN</creatorcontrib><creatorcontrib>DENG ZHONGHAO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HUANG JIANYU</au><au>HONG SHANGMING</au><au>WU GAOBIN</au><au>DENG ZHONGHAO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Color sensor module structure package</title><date>2023-01-24</date><risdate>2023</risdate><abstract>The invention discloses a color sensor module structure package. The color sensor module structure package comprises a substrate, a chip and a transparent molding substance, the chip is disposed on the substrate and has an ambient light sensor and a proximity sensor. The transparent molding substance covers the chip. A plurality of diffusion particles are doped in the transparent molding substance, and the transparent molding substance is provided with a groove area, and the groove area is located above the proximity sensor.
本发明公开一种颜色传感器模块结构封装，其包括一基板、一芯片以及一透明模塑物质。该芯片设置在该基板上，且具有一环境光传感器以及一近接传感器。该透明模塑物质覆盖该芯片。该透明模塑物质内掺杂多个扩散粒子，而且该透明模塑物质具有一凹槽区域，其中该凹槽区域位于该近接传感器上方。</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS COLORIMETRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING PHYSICS RADIATION PYROMETRY SEMICONDUCTOR DEVICES TESTING |
| title | Color sensor module structure package |
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