Color sensor module structure package

The invention discloses a color sensor module structure package. The color sensor module structure package comprises a substrate, a chip and a transparent molding substance, the chip is disposed on the substrate and has an ambient light sensor and a proximity sensor. The transparent molding substance covers the chip. A plurality of diffusion particles are doped in the transparent molding substance, and the transparent molding substance is provided with a groove area, and the groove area is located above the proximity sensor. 本发明公开一种颜色传感器模块结构封装，其包括一基板、一芯片以及一透明模塑物质。该芯片设置在该基板上，且具有一环境光传感器以及一近接传感器。该透明模塑物质覆盖该芯片。该透明模塑物质内掺杂多个扩散粒子，而且该透明模塑物质具有一凹槽区域，其中该凹槽区域位于该近接传感器上方。