Capacitive coupling isolation amplifier packaging structure and packaging method thereof

The invention discloses a capacitive coupling isolation amplifier packaging structure and a packaging method thereof, and belongs to the technical field of integrated circuit packaging. Comprising a double-base-island isolation type lead frame, a chip component, a chip capacitor, an assembly material, a bonding wire and a packaging material. The double-base-island isolation type lead frame comprises a left-side base island and a right-side base island which are isolated from each other, and more than two pins. The chip-type component is a semiconductor chip or a chip-type electronic component, the input side semiconductor chip or the chip-type electronic component is located in the left side area of the left-side base island, and the output side semiconductor chip or the chip-type electronic component is located in the right side area of the right-side base island. The chip capacitor is positioned in an area close to the two base islands; and the chip components and the chip capacitors are connected with the