ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

The invention relates to an electronic package and a manufacturing method thereof, comprising the following steps of: providing a bearing structure on which an electronic component and an encapsulation layer wrapping the periphery of the electronic component are arranged, forming a heat conduction structure on the encapsulation layer, and enabling the heat conduction structure and the encapsulation layer not to cover the electronic component; the bearing structure is arranged on a substrate through a plurality of soldering tin protruding blocks, laser beams are utilized to irradiate the electronic component, the bearing structure and the heat conduction structure, heat energy of the laser beams is transmitted to the plurality of soldering tin protruding blocks through the heat conduction structure, and therefore the soldering tin protruding blocks can be effectively and fixedly connected with the bearing structure. The problem that soldering tin is not wetted is avoided. 本发明涉及一种电子封装件及其制法，包括先提供一承载结构，其上设有电子元件及包