Method for pre-heating component and substrate processing apparatus

The invention provides a pre-heating processing method of a component and a substrate processing apparatus, which can properly pre-heat a component configured on a stage to improve the uniformity of processing on a substrate. In a method for pre-heating a component, a component that can be brought into contact with a stage on which a substrate is placed in a substrate processing apparatus and that can move relative to the stage is pre-heated. A method for pre-heating a component includes: positioning the component at a pre-heating position not in contact with a stage, and pre-heating the component by radiant heat from the stage; and bringing the component preheated in the step of preheating the component into contact with the stage. As a result, it is possible to improve the uniformity of the processing of the substrate by appropriately preheating the member. 本发明提供一种部件的预热处理方法和基板处理装置，能够将配置于载物台的部件适当地进行预热来提高针对基板的处理的均匀性。在部件的预热处理方法中，将能够与基板处理装置的用于载置基板的载物台接触且能够相对于该载物台相对移动的部件进行预热。部件的预热处理方法包括以下工序：将部件定位于与载物台不接触的预热位置，通过