Radiating device cut by diamond wire and manufacturing method thereof

The invention provides a manufacturing method of a heat dissipation device, which comprises the steps that a cutting machine table and a block body are provided, the cutting machine table comprises a plurality of diamond lines which are arranged in parallel, and the block body comprises a substrate area and an area to be cut which are connected; and performing a first cutting procedure on the to-be-cut area of the block body by the diamond lines, and cutting a plurality of first cutting marks in the to-be-cut area to form a plurality of fins. The invention further provides a heat dissipation device cut by the diamond wire. The heat dissipation device comprises a substrate area and a plurality of heat dissipation structures. The heat dissipation structures are formed on the substrate region. Wherein the distance between any two adjacent heat dissipation structures is between 50 microns and 500 microns, and the thickness of each heat dissipation structure is between 50 microns and 500 microns. 本发明提供一种散热装置的制造方法，