Method for manufacturing semiconductor device

Provided is a method for manufacturing a semiconductor chip capable of sufficiently suppressing the formation of a conductive material on a bump formation surface even if the conductive material for forming a shield layer is wound around the bump formation surface side of a semiconductor wafer. This...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHINODA TOMONORI, NEMOTO TAKU, TAMURA SAKURAKO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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