Method and apparatus for efficiently manufacturing high performance electronic devices with cable interconnects

A subassembly for efficiently and reliably assembling a high performance electronic device. The electronic device may include a plurality of cable interconnects in a sub-assembly that is then mechanically and electrically connected to a PCB filled with high performance electronic components. A first...

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1. Verfasser: LONG MICHAEL DEVIN
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:A subassembly for efficiently and reliably assembling a high performance electronic device. The electronic device may include a plurality of cable interconnects in a sub-assembly that is then mechanically and electrically connected to a PCB filled with high performance electronic components. A first end of a cable in the cable interconnect may be terminated by a first type of connector configured to connect to the PCB via a downward force. The second end of the cable may be terminated with a second type of connector that may be connected to other parts of the electronic system incorporating the electronic device. A connector at the first end of the cable may be releasably retained within the manager. The connector can be simply mounted to the PCB by positioning the manager relative to the PCB, releasing the connector from the manager, and urging the connector into engagement with a mounting location on the PCB. 一种用于高效且可靠地组装高性能电子装置的子组件。电子装置可以在子组件中包括多个线缆互连件,该子组件随后被机械连接且电连接到填充有高性能电子部件的PCB。线缆互连件中的线缆的第一端可以由第一类型连接器