Electronic device

The invention provides an electronic device. The electronic device comprises a first substrate, a second substrate and an adhesion element, the first substrate has a plurality of perforations. The second substrate is disposed on the first substrate. The adhesive element is disposed between the first...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: XIE HONGMING, YAN RENXIANG, WANG MINGDIAN, DING JINGLONG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The invention provides an electronic device. The electronic device comprises a first substrate, a second substrate and an adhesion element, the first substrate has a plurality of perforations. The second substrate is disposed on the first substrate. The adhesive element is disposed between the first substrate and the second substrate, wherein the adhesive element at least partially overlaps the plurality of perforations. The electronic device does not need to be provided with screw holes, can maintain completeness and no damage of the first substrate and the second substrate, can save material cost, and can save time cost due to the fact that automation is facilitated. 本揭露提供一种电子装置,包括第一基板、第二基板以及黏着元件。第一基板具有多个穿孔。第二基板设置在第一基板上。黏着元件设置在第一基板与第二基板之间,其中黏着元件与多个穿孔至少部分重叠。本揭露的电子装置无须设置螺孔,可维持第一基板与第二基板的完整与无损伤,可节省材料成本,且因利于自动化,因而亦可节省时间成本。