Thermal interface composition, thermal interface material and preparation method thereof

The invention relates to a thermal interface composition, which comprises a polysiloxane component, a heat conduction component, a curing agent, a curing accelerator, an organic silicon coupling agent and a crosslinking auxiliary agent with more than three epoxy groups. The polysiloxane component includes a first polysiloxane and a second polysiloxane in an amount ranging from 50 wt% to less than 100 wt%. The thermally conductive component includes a first thermally conductive filler in an amount ranging from 30 wt% to less than 70 wt%, a second thermally conductive filler in an amount ranging from 30 wt% to less than 70 wt%, and a third thermally conductive filler in an amount ranging from 0 wt% to 40 wt%. Based on the total amount of 100 parts by weight of the polysiloxane component, the total amount of the heat conduction component is more than 600 parts by weight and less than 1500 parts by weight, and the dosage range of the crosslinking auxiliary agent with more than three epoxy groups is more than 0.5