Semiconductor device and preparation method thereof, and packaging structure of gallium nitride chip

The invention discloses a semiconductor device and a preparation method thereof, and a packaging structure of a gallium nitride chip, and the semiconductor device comprises a heat conduction plate, one side surface of which is provided with an installation concave part; the semiconductor device is arranged in the mounting concave part; the electrical carrier plate is arranged on the surface of one side of the heat conducting plate, and an electrode bonding pad of the semiconductor device is electrically connected with a lead of the electrical carrier plate; wherein the electrical carrier plate comprises a covering part right opposite to the semiconductor device, and a first heat conduction piece is arranged between the covering part and the semiconductor device. According to the semiconductor device provided by the embodiment of the invention, the mounting concave part is arranged, and the covering part is used for covering the active region of the semiconductor device, so that the semiconductor device is pro