Novel formula of notch polishing pad

The invention discloses a novel formula of a notch polishing pad, and a proportioning method of the novel formula comprises the following steps: S1, firstly, weighing polyether polyol, a chain extender and isocyanate according to corresponding proportions in parts by weight, putting the weighed components into corresponding storage vessels for later use, and polishing by using a polishing machine, the equipment state is checked before polishing, process adjustment is conducted after it is guaranteed that no abnormity exists, and different machining processes can be set according to different incoming material types; and S2, placing and fixing the polished wafer on a NOTCH station of a polishing machine, adopting special polishing cloth in a matched manner, and pressurizing the edge of the silicon wafer through high-speed rotation of the polishing cloth. According to the polishing pad, when the Shore hardness is higher than 79D, the fuzzing condition of the edge of the PAD is well improved, a novel foaming mat