Mechanical stripping device for stripping wafer from laser modified crystal

The invention belongs to the field of crystal processing, and particularly relates to a mechanical stripping device for stripping a wafer from a laser-modified crystal. Comprising a storage box for storing glass plates, a carrying manipulator, an X-axis sliding rail for bearing the carrying manipula...

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Hauptverfasser: NIU BEN, TIAN YAFANG, ZHANG ZHIYAO, HU BEICHEN, ZHANG CAIYUN, LIU YANLI, TANG JINGTING, ZHANG HONGMEI
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creator NIU BEN
TIAN YAFANG
ZHANG ZHIYAO
HU BEICHEN
ZHANG CAIYUN
LIU YANLI
TANG JINGTING
ZHANG HONGMEI
description The invention belongs to the field of crystal processing, and particularly relates to a mechanical stripping device for stripping a wafer from a laser-modified crystal. Comprising a storage box for storing glass plates, a carrying manipulator, an X-axis sliding rail for bearing the carrying manipulator to walk, a stripping electric cylinder for applying stripping force, a pressing electric cylinder for providing pressing force, a vacuum ceramic suction cup, an X-axis sliding table for bearing the pressing electric cylinder, a jacking device, a UV irradiation source, a heating source, a glass plate recycling box, a portal frame and a base table. The jacking device comprises an electric cylinder adapter, a jacking rod, a supporting column, a stripping box, a crystal tray and an air cylinder. The laser vertical modification mechanical stripping technology is an advanced crystal processing technology, and compared with a multi-wire cutting technology commonly adopted in the industry, the laser vertical modificati
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subjects BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
title Mechanical stripping device for stripping wafer from laser modified crystal
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