Mechanical stripping device for stripping wafer from laser modified crystal

The invention belongs to the field of crystal processing, and particularly relates to a mechanical stripping device for stripping a wafer from a laser-modified crystal. Comprising a storage box for storing glass plates, a carrying manipulator, an X-axis sliding rail for bearing the carrying manipulator to walk, a stripping electric cylinder for applying stripping force, a pressing electric cylinder for providing pressing force, a vacuum ceramic suction cup, an X-axis sliding table for bearing the pressing electric cylinder, a jacking device, a UV irradiation source, a heating source, a glass plate recycling box, a portal frame and a base table. The jacking device comprises an electric cylinder adapter, a jacking rod, a supporting column, a stripping box, a crystal tray and an air cylinder. The laser vertical modification mechanical stripping technology is an advanced crystal processing technology, and compared with a multi-wire cutting technology commonly adopted in the industry, the laser vertical modificati