Thermal stress simulation method in ultra-thin glass tempering process
The invention relates to a thermal stress simulation method in an ultra-thin glass tempering process, which comprises the following steps of: S1, creating an ultra-thin glass plate tempering model, selecting a group of ultra-thin glass plates which are vertically jetted as stress simulation objects,...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | chi ; eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | CHENG GUANGGUI ZHU KEQIAN YAN JIANYU DING JIANNING |
description | The invention relates to a thermal stress simulation method in an ultra-thin glass tempering process, which comprises the following steps of: S1, creating an ultra-thin glass plate tempering model, selecting a group of ultra-thin glass plates which are vertically jetted as stress simulation objects, and establishing a computational domain of the ultra-thin glass, the computational domain comprises a nozzle internal flow field area, a nozzle and glass plate boundary flow field area and a glass plate solid field area, S2, defining material attributes, discretizing a model into a grid model after solid modeling, defining an elastic modulus E and a Poisson's ratio mu of glass by defining unit attributes and grid generation control, setting a flow field domain material as air, and setting the flow field domain material as air; setting the change of thermophysical parameters of the glass along with the temperature; according to the method, accurate numerical values are provided for thermal stress simulation of the |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115587548A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115587548A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115587548A3</originalsourceid><addsrcrecordid>eNrjZHALyUgtyk3MUSguKUotLlYozswtzUksyczPU8hNLcnIT1HIzFMozSkpStQtyQAy03MSgapKUnMLUosy89IVCoryk4H6eBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGpqYW5qYmFozExagB5IDQ_</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Thermal stress simulation method in ultra-thin glass tempering process</title><source>esp@cenet</source><creator>CHENG GUANGGUI ; ZHU KEQIAN ; YAN JIANYU ; DING JIANNING</creator><creatorcontrib>CHENG GUANGGUI ; ZHU KEQIAN ; YAN JIANYU ; DING JIANNING</creatorcontrib><description>The invention relates to a thermal stress simulation method in an ultra-thin glass tempering process, which comprises the following steps of: S1, creating an ultra-thin glass plate tempering model, selecting a group of ultra-thin glass plates which are vertically jetted as stress simulation objects, and establishing a computational domain of the ultra-thin glass, the computational domain comprises a nozzle internal flow field area, a nozzle and glass plate boundary flow field area and a glass plate solid field area, S2, defining material attributes, discretizing a model into a grid model after solid modeling, defining an elastic modulus E and a Poisson's ratio mu of glass by defining unit attributes and grid generation control, setting a flow field domain material as air, and setting the flow field domain material as air; setting the change of thermophysical parameters of the glass along with the temperature; according to the method, accurate numerical values are provided for thermal stress simulation of the</description><language>chi ; eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230110&DB=EPODOC&CC=CN&NR=115587548A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230110&DB=EPODOC&CC=CN&NR=115587548A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHENG GUANGGUI</creatorcontrib><creatorcontrib>ZHU KEQIAN</creatorcontrib><creatorcontrib>YAN JIANYU</creatorcontrib><creatorcontrib>DING JIANNING</creatorcontrib><title>Thermal stress simulation method in ultra-thin glass tempering process</title><description>The invention relates to a thermal stress simulation method in an ultra-thin glass tempering process, which comprises the following steps of: S1, creating an ultra-thin glass plate tempering model, selecting a group of ultra-thin glass plates which are vertically jetted as stress simulation objects, and establishing a computational domain of the ultra-thin glass, the computational domain comprises a nozzle internal flow field area, a nozzle and glass plate boundary flow field area and a glass plate solid field area, S2, defining material attributes, discretizing a model into a grid model after solid modeling, defining an elastic modulus E and a Poisson's ratio mu of glass by defining unit attributes and grid generation control, setting a flow field domain material as air, and setting the flow field domain material as air; setting the change of thermophysical parameters of the glass along with the temperature; according to the method, accurate numerical values are provided for thermal stress simulation of the</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHALyUgtyk3MUSguKUotLlYozswtzUksyczPU8hNLcnIT1HIzFMozSkpStQtyQAy03MSgapKUnMLUosy89IVCoryk4H6eBhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvLOfoaGpqYW5qYmFozExagB5IDQ_</recordid><startdate>20230110</startdate><enddate>20230110</enddate><creator>CHENG GUANGGUI</creator><creator>ZHU KEQIAN</creator><creator>YAN JIANYU</creator><creator>DING JIANNING</creator><scope>EVB</scope></search><sort><creationdate>20230110</creationdate><title>Thermal stress simulation method in ultra-thin glass tempering process</title><author>CHENG GUANGGUI ; ZHU KEQIAN ; YAN JIANYU ; DING JIANNING</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115587548A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHENG GUANGGUI</creatorcontrib><creatorcontrib>ZHU KEQIAN</creatorcontrib><creatorcontrib>YAN JIANYU</creatorcontrib><creatorcontrib>DING JIANNING</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHENG GUANGGUI</au><au>ZHU KEQIAN</au><au>YAN JIANYU</au><au>DING JIANNING</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thermal stress simulation method in ultra-thin glass tempering process</title><date>2023-01-10</date><risdate>2023</risdate><abstract>The invention relates to a thermal stress simulation method in an ultra-thin glass tempering process, which comprises the following steps of: S1, creating an ultra-thin glass plate tempering model, selecting a group of ultra-thin glass plates which are vertically jetted as stress simulation objects, and establishing a computational domain of the ultra-thin glass, the computational domain comprises a nozzle internal flow field area, a nozzle and glass plate boundary flow field area and a glass plate solid field area, S2, defining material attributes, discretizing a model into a grid model after solid modeling, defining an elastic modulus E and a Poisson's ratio mu of glass by defining unit attributes and grid generation control, setting a flow field domain material as air, and setting the flow field domain material as air; setting the change of thermophysical parameters of the glass along with the temperature; according to the method, accurate numerical values are provided for thermal stress simulation of the</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | chi ; eng |
recordid | cdi_epo_espacenet_CN115587548A |
source | esp@cenet |
subjects | CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING PHYSICS |
title | Thermal stress simulation method in ultra-thin glass tempering process |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-04T14%3A28%3A58IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHENG%20GUANGGUI&rft.date=2023-01-10&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN115587548A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |