Thermal stress simulation method in ultra-thin glass tempering process
The invention relates to a thermal stress simulation method in an ultra-thin glass tempering process, which comprises the following steps of: S1, creating an ultra-thin glass plate tempering model, selecting a group of ultra-thin glass plates which are vertically jetted as stress simulation objects,...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to a thermal stress simulation method in an ultra-thin glass tempering process, which comprises the following steps of: S1, creating an ultra-thin glass plate tempering model, selecting a group of ultra-thin glass plates which are vertically jetted as stress simulation objects, and establishing a computational domain of the ultra-thin glass, the computational domain comprises a nozzle internal flow field area, a nozzle and glass plate boundary flow field area and a glass plate solid field area, S2, defining material attributes, discretizing a model into a grid model after solid modeling, defining an elastic modulus E and a Poisson's ratio mu of glass by defining unit attributes and grid generation control, setting a flow field domain material as air, and setting the flow field domain material as air; setting the change of thermophysical parameters of the glass along with the temperature; according to the method, accurate numerical values are provided for thermal stress simulation of the |
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