Thermoplastic resin composition having high rigidity and low coefficient of linear thermal expansion, and molded article comprising same
The present invention provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion, and a molded article comprising the same. Specifically, the thermoplastic resin composition comprises: a base resin comprising at least two polypropylene-based res...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The present invention provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion, and a molded article comprising the same. Specifically, the thermoplastic resin composition comprises: a base resin comprising at least two polypropylene-based resins having different melt indexes; an elastomer having a melt index (190 DEG C, 2.16 kg) of from 20 g/10 minutes to 35 g/10 minutes as measured by ASTM D1238; and inorganic particles; wherein the thermoplastic resin composition has a flexural modulus (FM) of 2500 MPa or more and a coefficient of linear thermal expansion (CLTE) of 60 [mu] m/m DEG C or less.
本发明提供一种具有高刚性和低线性热膨胀系数的热塑性树脂组合物以及包含该组合物的模制品。具体地,该热塑性树脂组合物包含:基础树脂,该基础树脂包含具有不同熔融指数的至少两种聚丙烯基树脂;弹性体,该弹性体具有通过ASTM D1238测量的20g/10分钟至35g/10分钟的熔融指数(190℃,2.16kg);以及无机颗粒;其中该热塑性树脂组合物具有2500MPa以上的弯曲模量(FM)和60μm/m·℃以下的线性热膨胀系数(CLTE)。 |
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