Clutter suppression structure based on temperature compensation type surface acoustic wave device
The invention belongs to the field of surface acoustic wave devices, and particularly relates to a clutter suppression structure based on a temperature compensation type surface acoustic wave device. The clutter suppression structure comprises a temperature compensation layer, a piezoelectric substr...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention belongs to the field of surface acoustic wave devices, and particularly relates to a clutter suppression structure based on a temperature compensation type surface acoustic wave device. The clutter suppression structure comprises a temperature compensation layer, a piezoelectric substrate layer and a metal electrode layer, wherein the metal electrode layer is arranged on the upper surface of the piezoelectric substrate layer; the temperature compensation layer is arranged on the metal surface of the metal electrode layer; the top surface of the temperature compensation layer is arranged to be two symmetrical inclined surfaces, and the cross sections of the two symmetrical inclined surfaces are in a V. According to the temperature compensation type surface acoustic wave device, the top surface of the temperature compensation layer is arranged to be two symmetrical inclined surfaces, so that when sound waves are transmitted to the upper surface of the temperature compensation layer, the incident a |
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