Electrochemical polishing equipment for pipeline and pipe fitting for semiconductor special gas system

The invention discloses pipeline and pipe fitting electrochemical polishing equipment for a semiconductor special gas system, and belongs to the technical field of pipeline polishing. Comprising a first supporting frame and further comprises an air cylinder fixedly connected to the surface of the fi...

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Hauptverfasser: GUO WEIQIANG, WENG PENGBIN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses pipeline and pipe fitting electrochemical polishing equipment for a semiconductor special gas system, and belongs to the technical field of pipeline polishing. Comprising a first supporting frame and further comprises an air cylinder fixedly connected to the surface of the first supporting frame, and the output end of the air cylinder is fixedly connected with a second supporting frame; the chuck is fixedly connected to the side wall of the second supporting frame, the surface of the chuck is fixedly connected with a clamping mechanism, and the clamping mechanism is used for clamping a pipe fitting; the piston assembly is fixedly connected to the surface of the second supporting frame, the side wall of the piston assembly is fixedly connected with a first circulating pipe and a second circulating pipe, the first circulating pipe and the second circulating pipe are fixedly connected with one-way valves, and the outlet end of the second circulating pipe is aligned to the liquid inlet of