Clamping device for three-dimensional stacking of multi-layer plates

The invention relates to the technical field of circuit board processing equipment, in particular to a multi-layer board three-dimensional stacking clamping device which comprises two mounting plates arranged at intervals, a support, a rack and a plurality of guide rods, the lower end of the support...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN NAIHUA, LI HANTAO, LIU GUOCHUAN, CHEN ZUXIAN, LI ZENGRONG, XIE SIQIAO, HUANG NENGDIAO
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to the technical field of circuit board processing equipment, in particular to a multi-layer board three-dimensional stacking clamping device which comprises two mounting plates arranged at intervals, a support, a rack and a plurality of guide rods, the lower end of the support is fixedly connected with the two mounting plates, and the rack is located on one side of the support and fixedly connected with the guide rods. The guide rods are arranged on the two sides of the rack, and one ends of the guide rods penetrate through the support. The magnetic force of the electromagnet exerts repulsive force on the upper end of the magnetic rod, the rubber pad at the lower end of the bottom plate makes contact with the upper side of the multi-layer plate, the rubber pad makes contact with the upper side of the multi-layer plate and exerts acting force on the multi-layer plate, and the magnetic force of the electromagnet is controllable. The multi-layer board can prevent the rubber pad from exerti