Circuit board clamping film processing method and circuit board
The invention relates to the technical field of PCBs, in particular to a circuit board clamping film processing method and a circuit board, firstly, the electroplating clamping film type of the current circuit board is confirmed, the electroplating clamping film processing mode is selected according...
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| creator | HUANG HAILONG FAN TINGHUI ZOU DONGHUI |
| description | The invention relates to the technical field of PCBs, in particular to a circuit board clamping film processing method and a circuit board, firstly, the electroplating clamping film type of the current circuit board is confirmed, the electroplating clamping film processing mode is selected according to the electroplating clamping film type of the current circuit board, and when the electroplating clamping film type of the circuit board is an electroplating clamping film before etching or copper stripping, the electroplating clamping film processing mode is selected; according to the method, the electroplating clamping film is removed by laser ablation or the electroplating clamping film is removed by adopting an adhesive, and when the type of the electroplating clamping film of the circuit board is an etched or copper-removed electroplating clamping film, the electroplating clamping film is removed by adopting the adhesive. According to the invention, the electroplating clamping film of the circuit board with |
| format | Patent |
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According to the invention, the electroplating clamping film of the circuit board with</description><language>chi ; eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230103&DB=EPODOC&CC=CN&NR=115568106A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230103&DB=EPODOC&CC=CN&NR=115568106A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HUANG HAILONG</creatorcontrib><creatorcontrib>FAN TINGHUI</creatorcontrib><creatorcontrib>ZOU DONGHUI</creatorcontrib><title>Circuit board clamping film processing method and circuit board</title><description>The invention relates to the technical field of PCBs, in particular to a circuit board clamping film processing method and a circuit board, firstly, the electroplating clamping film type of the current circuit board is confirmed, the electroplating clamping film processing mode is selected according to the electroplating clamping film type of the current circuit board, and when the electroplating clamping film type of the circuit board is an electroplating clamping film before etching or copper stripping, the electroplating clamping film processing mode is selected; according to the method, the electroplating clamping film is removed by laser ablation or the electroplating clamping film is removed by adopting an adhesive, and when the type of the electroplating clamping film of the circuit board is an etched or copper-removed electroplating clamping film, the electroplating clamping film is removed by adopting the adhesive. 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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | Circuit board clamping film processing method and circuit board |
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