Circuit board clamping film processing method and circuit board

The invention relates to the technical field of PCBs, in particular to a circuit board clamping film processing method and a circuit board, firstly, the electroplating clamping film type of the current circuit board is confirmed, the electroplating clamping film processing mode is selected according...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUANG HAILONG, FAN TINGHUI, ZOU DONGHUI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to the technical field of PCBs, in particular to a circuit board clamping film processing method and a circuit board, firstly, the electroplating clamping film type of the current circuit board is confirmed, the electroplating clamping film processing mode is selected according to the electroplating clamping film type of the current circuit board, and when the electroplating clamping film type of the circuit board is an electroplating clamping film before etching or copper stripping, the electroplating clamping film processing mode is selected; according to the method, the electroplating clamping film is removed by laser ablation or the electroplating clamping film is removed by adopting an adhesive, and when the type of the electroplating clamping film of the circuit board is an etched or copper-removed electroplating clamping film, the electroplating clamping film is removed by adopting the adhesive. According to the invention, the electroplating clamping film of the circuit board with