Chip mass transfer method, chip substrate and positioning plate

The invention provides a chip mass transfer method, which comprises the following steps that chips are placed in liquid, the liquid wrapping the chips is solidified to form spheres, and a chip to be transferred is wrapped in each sphere; placing the balls on a target substrate, and enabling the balls wrapping the chips to fall into each hole in the target substrate; and solid substances except the chip in the sphere are removed, and the chip falls into the hole of the target substrate, so that the chip is enveloped by the hole in the target substrate. According to the invention, the liquid wrapping the chip is solidified to form the sphere, and the sphere is placed on the target substrate, so that the sphere wrapping the chip falls on the hole opening of each hole in the target substrate; according to the technical scheme, after the solid matter in the sphere is removed, the chip falls into the hole of the target substrate, whether complete transfer is completed or not can be quickly known by detecting the so