Semiconductor device

The embodiment of the invention provides a semiconductor device. The conductive structure is reduced in height and increased in width. In particular, a sacrificial self-aligned contact layer and a sacrificial metal contact etch stop layer are used to form a reduced resistance conductive structure. A...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ZHANG JIAHAO, WANG ZHIHAO, ZHUANG ZHENGJI, HUANG LINYU, WANG SHENGCONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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