Electronic device inspection device

This electronic device inspection apparatus (10) is provided with: an inspection table (3) for positioning and holding an electrode disposed on a semiconductor device (90); a contact (2) which is made of a shape memory alloy and has a long thin plate shape, the base part (2b) is fixed on the examination table (3), and the variable part (2a) has a vortex shape at a first temperature and spreads a vortex at a second temperature; and a measuring unit (61) that measures the semiconductor device (90) by energizing the electrode via the contact (2), and is configured such that the axis of the vortex of the variable part (2a) is parallel to the electrode surface of the positioned electrode, and a contact region (Rc) along the longitudinal direction is formed between the variable part (2a) and the positioned electrode at the second temperature. 本申请的电子器件检查装置(10)具备：检查台(3)，对配置于半导体装置(90)的电极进行定位并保持；触头(2)，由形状记忆合金形成为长条薄板状，基部(2b)固定于检查台(3)，可变部(2a)在第一温度下呈漩涡形状且在第二温度下展开漩涡；以及测定部(61)，通过经由触头(2)向电极通电，来测定半导体装置(90)，构成为可变部(2a)的漩涡的轴与定位后